ADE‐BGA  Series test sockets are build with a wide range of ESD materials and high performance spring probes to achieve high test yield with lower  test costs. Maintenance of these sockets are effortless and replacement of parts can be easily rebuild and replaced on site.

BGA Test Socket Specifications: Device Type BGA, uBGA, TFBGA & other Pitching 0.25 mm and above Pin count > 2,000 I/O Contact Resistance < 100 mOhm Contact Force 20 to 35g Test  Frequency > 20 GHz@‐3dB Contact Life > 200K insertions Socket Material ESD Plastic/AL with ESD coating Temperate range ‐45 to 125 C Suitable for all lead free devices We can customise the socket design for your existing footprint allowing custom features to be incorporated for your component clearance needs or lid cover requirements.